QMC SLF Series는 다양한 소재의 Wafer를 Laser를 이용하여 개별 Chip으로 Grooving 또는 Full Cutting 하는 장비입니다.
Item | SLF Series |
---|---|
Wafer | 4inch |
Configuration | Load Port, Transfer, Stage, Vision, Laser, BDS |
System dimension(W x D x H) | 2,200mm x 2,250mm x 1,950mm |
Throughput | ≤ 7.3 wafer/hour @ Chip Size: 400um x 400um, Depth: 32um |
Source | DPSS Laser |
Stage | X, Y, θ, Z-Axis (Linear Motor & Scale) |
Accuracy | X, Y, Z ≤ ±2um, θ ≤ ±0.001° |
Optic | Objective Lens Mount Assembly and Adapter |
Vision | 2/3“Camera, Pixel Resolution 0.345 μm |
Load/Un-Load | Cassette |
Copntrol S/W | PC Control |