· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Camera Module
Laser Marking System - Shield Can

SLM Series

SLM-110

QMC SLM Series는 레이저를 이용하여 PCB위 Shield Can기판 표면에 바코드 및 일련번호를 Marking 하는 장비입니다. 제조환경에 맞추어 인라인 구성이 가능합니다.

OUTPUT

FEATURES

High Accuracy; Marking ≤ ± 50 um
High Performance
Tact Time; ≤ 110 sec/PCB (28unit/PCB)
UPH; ≥ 915 unit/hour
공정 및 검사 일괄 처리
In-line 구성 가능.

SPECIFICATION

Item	SLM-110
Substrate	PCB: 139.5mm x 118.0mm Array: 23.9mm x 15.5mm
Configuration	Conveyor, Laser, Optics, Vision, Buffer, Inspection
System Dimension(W x D x H)	1,090 mm x 1,040 mm x 1,557 mm
Throughput Tact Time	≤ 110 sec/PCB
Throughput UPH	≥ 32 PCB/hour
Marking	Material – SUS, Aluminum 형태 – 2D Code, Font, Logo Accuracy ≤ ± 50 um
Vision	2/3” Camera, Pixel Resolution 25.4 μm
Load/Un-Load	In-Line Conveyor or Magazine
Copntrol S/W	PC Control