· 제품정보
- microLED(miniLED) Display
- - microLED Laser Lift-off System-DPSS
- - microLED Laser Lift-off System-Excimer
- - microLED Laser Bonding System
- - miniLED Transfer System
- - miniLED Laser Repair System
- Semiconductor
- - Wafer Back-side Laser marking system
- - Die Inspection & Sorting System
- - Wafer Spin Coater - CIS
- - Wafer Spin Remover - CIS
- - Die Transfer
Laser
microLED Laser Lift-off System-DPSS
SLO Series
SLO-300
QMC SLO Series는 DPSS Laser를 이용하여, Sapphire Wafer 또는 Substrate에서 micro LED Chip을 분리하는 공정의 장비입니다. 분리하고자 하는 Chip을 선택적으로 분리하는 Selective LLO 방식과 전체 Chip을 분리하는 Mass LLO 방식 중 하나를 선택할 수 있습니다.
OUTPUT
FEATURES
- Enable Selective or Mass Laser Lift-off
- Stable Top Hat Beam Implementation
- Low Process Energy Density; Damage Free
- Fast and Accurate Vision Alignment
- Low Costs of Operation & Maintenance
- Easy Maintenance
SPECIFICATION
| Item | Selective LLo | Mass LLo |
|---|---|---|
| Laser Source | DPSS Laser(Ultra Short Pulse) | DPSS Laser(Ultra Short Pulse) |
| Spot Size | 10um ~ 50um | 50um |
| Beam Delivery System | Homogenizer, Mask & Focusing Lens | Homogenizer & Scanner |
| Source | upto 6inch Wafer | upto 6inch Wafer |
| Target | ≤ 370mm x 470mm Substate | ≤ 370mm x 470mm Substate |
| Stage | X-Y-Z-T(Linear Motor Drive) | X-Y-Z-T(Linear Motor Drive) |
| Chuck | 380mm x 480mm(Porous Vacuum) | 380mm x 480mm(Porous Vacuum) |
| Vision | Inspection & Alignment (2/3inch, Pixel Resolution 0.345um) |
Inspection & Alignment (2/3inch, Pixel Resolution 0.345um) |
| Cycle Time | 317 sec/wafer @ 4inch wafer | 403 sec/wafer @ 4inch wafer |
| System Dimension(W x D x H) | 2,054mm x 2,200mm x 2,217mm, Exclude Signal lamp |
2,054mm x 2,200mm x 2,217mm, Exclude Signal lamp |