· 제품정보

microLED(miniLED) Display: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Transfer System; - miniLED Laser Repair System

Semiconductor: - Wafer Back-side Laser marking system; - Die Inspection & Sorting System; - Wafer Spin Coater - CIS; - Wafer Spin Remover - CIS; - Die Transfer

Probe Card: - Laser Drilling System - MEMS Probe Card; - Auto Pin Insert System - MEMS Probe Card

Laser: - microLED Laser Lift-off System-DPSS; - microLED Laser Lift-off System-Excimer; - microLED Laser Bonding System; - miniLED Laser Repair System; - Laser Drilling System - MEMS Probe Card; - Wafer Laser Full cutting System - Sapphire; - Laser Scribing System; - Laser Marking System

Camera Module: - VICSEL Tester; - Tray Cover Attaching System; - Laser Marking System - Shield Can

Conventional LED: - Wafer Laser Full cutting System - Sapphire; - LED Test Handler; - Taping Machine; - Sorter; - Prober; - Dispenser; - Phosphor Coater; - CSP Blade Cutter

· 회사소개

· 고객지원

Probe Card
Auto Pin Insert System - MEMS Probe Card

CPI Series

CPI-100

QMC CPI Series는 반도체 Wafer 검사 목적의 MEMS Prober Card 제조용 Probe Pin 자동 삽입 장비입니다.

OUTPUT

FEATURES

High Performance
Pin Size ≥ 30um x 30um
Tact time ≤ 10 sec/pin
High Yield; Pin Insert ≥ 99%
Process Stability
3단계 검사를 통한 Insert 수율 향상
하중 제어를 통한 안정적 Inserting.

SPECIFICATION

Item	CPI-100
Substrate	MEMS Probe Card용 세라믹 기판; 120 x 120mm
Configuration	Pin Magazine, Transfer, Gripper, Stage, Vision, Tapping
System dimension(W x D x H)	1,800mm x 1,470mm x 1,800mm
Throughput Tact Time	≤ 10 sec/pin
Throughput UPH	≥ 360 pin/hour
Pin Insert	Yield ≥ 99%
Stage	X, Y, Z Axis(Linear Motor Drive)
Gripper	X, Y, Z, Tx, Ty, Grip Axis(Piezo Motor Drive)
Vision	2/3“ Camera, Pixel Resolution: 0.345 μm
Load/Un-Load	Manual (Pin Magazine/Pin Block)
Copntrol S/W	PC Control