QMC SLD Series는 반도체 Wafer 검사 목적의 MEMS Probe Card 기판 제조용 Laser Micro Machining 장비입니다. Micro Hole Drilling, Cutting, Marking의 기능을 제공합니다.
Item | SLD-100 |
---|---|
Substrate | Si3N4: Thk. ≤ 0.35mm PHOTOVEEL: Thk. ≤ 0.35mm8 ~ 12” |
Configuration | Stage, Vision, Laser, BDS, Dust Collector |
System Dimension(W x D x H) | 1,750 mm x 1,900 mm x 1,750 mm |
Throughput | Tact time ≤ 1 sec/hole |
Accuracy |
Position ≤ ±2μm Hole Size ≤ ±2μm Taper Angle ≤ 0.5° |
Source | UV or IR Laser Depend on Material |
Stage | X, Y, Z Axis(Linear Motor Drive) |
Vision | 2/3” Camera, Pixel Resolution 0.345 μm |
Load/Un-Load | Manual |
Control S/W | PC Control |