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n High speed performance for mass production
- Cycle time: 0.21sec/chip
- UPH: 17,000ea/hr
n Full automatic operation system
- 10 wafer cassette, 32 BIN cassette
- Automatic loading/unloading Wafer / BIN cassette
- Automatic wafer alignment & height leveling function
- Automatic vision inspection: Double chip, Broken chip
- Barcode reader to manage Wafer ID
n High accuracy
- High sorting accuracy: ±25um, ±3˚
n Others
- Easy to check and replace collect and eject pin with vision system
- Soft pick up mechanism for minimized mechanical stress of chip at pick up
- Special type illumination of vision system for PSS wafer & RS wafer
- SEMI standard graphic user interface
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Features
